
Keep your IC devices permanently safe.
McDRY (drying cabinet) enables moisture-proof storage of IC components at very low humidity.
IPC/JEDEC J-STD-033D IEC-61340-5-1
certified
Avoidance of microcracks during the reflow process
(Popcorn Cracks)
Low humidity
of less than 1 RH%

Advantages
With McDry, you can reliably avoid production errors, speed up your workflow and track processes.
Reliable quality
- All models receive 1%RH
- Conforms to IPC/JEDEC J-STD 033D and IPC-1602 Guidelines
- ESD-safe design in accordance with IEC-61340-5-1(ESD) standard
- Infinite service life of your product
Adaptable product line
- Large selection of enclosures including CE models
- Alternative to baking, MBBs and nitrogen storage
- Optional accessories for tracking, notification or communication
Professional support
- Short delivery time (cabinet in stock in Germany)
- All calibrations are supplied with certificates
- Proven service with over 20 years of experience
Models
The right product for your application.



Function
Dehumidification of the drying cabinet, dehumidification of the ICs to prevent microcracks.
The McDry electronic dry storage cabinets enable storage at low humidity without the use of nitrogen. Moisture is extracted from the cabinets through the use of a high-performance zeolite desiccant. The desiccant is automatically recycled by a heating mechanism, optimizing its absorption capacity, and does not need to be replaced. The moisture absorbed by the powerful zeolite desiccant is evaporated and released outside the cabinet. Memory metal is used for fail-safe ventilation.
Best in class, consistently improved
- Lockable doors with high-quality seal
- Solid steel construction with ESD-safe design
- Adjustable shelves (optionally made of stainless steel)
- Digital RH meter Humidity: 1 - 70% RH Measuring accuracy: +/- 3% RH
- Drying unit high-performance zeolite desiccant (no nitrogen required) Desiccant is automatically recycled (no replacement required)
- EDS Safe Caster Standard for lockers of sizes 501, 1001 and 1002.
- Electrical earthing Avoidance of static electricity

How do microcracks develop?
Normal storage
Water vapor
Humidity diffuses into the IC during storage.
Reflow process
Accumulation of moisture, increase in pressure
The interface between the matrix and the resin is peeled off by the water vapor pressure during the reflow process.
Reflow process
The packaging is inflated by expanding moisture
When heated further, the steam expands and stretches the packaging.
Reflow process
The IC housing has cracks.
The packaging releases the water due to the pressure, which leads to cracks.
About us
A pioneer in moisture management for the assembly industry
ERC, based in Japan, is a pioneer in the field of “moisture protection of IC packages” in the chip assembly industry and a company specializing in the manufacture and sale of storage cabinets. ERC began selling McDry products (storage cabinets to control the moisture content in IC packages) to the chip assembly industry in 1990. In the more than 20 years since then, some 2,000 companies around the world, including major electronics and automotive manufacturers, have installed and used around 10,000 McDry cabinets.
Our products
The right option for your workflow
Support
Everything that keeps you going